Dear Rajneesh,
As per ASME SEC VIII DIV-1,
For thickness above 6 mm "Hard stamp"to be used
For Thickness below 6 mm" Low stress stamp"to be used
It's a good engineering practise to establish traceability.
Thanks & Regards,
vipin
As per ASME SEC VIII DIV-1,
For thickness above 6 mm "Hard stamp"to be used
For Thickness below 6 mm" Low stress stamp"to be used
It's a good engineering practise to establish traceability.
Thanks & Regards,
vipin
On Thu, Sep 24, 2009 at 10:19 AM, Rajneesh Gaur <rajneeshgaur@gmail.com> wrote:
Dear all,
First of all I am new to the group and find the information very interesting and useful.
Can someone answer this question, with references to code etc;
(1) what is criteria of hard punch ? when its required ? above what thickness it is allowed?
Regards
Rajneesh Gaur
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